Housing Wafer Terminal 1.25mm

The 1.25mm wafer connector terminal is a critical component within the connector assembly, enabling electrical connections between mating connectors in various electronic devices and equipment. Its design, configuration, and material properties are optimized for reliability, durability, and efficient signal transmission.

The SMT (Surface Mount Technology) 1.25mm wafer connector terminal refers to the specific type of terminal designed for surface mount applications within a 1.25mm pitch wafer connector. These terminals are crucial components that facilitate electrical connections between the male and female components of the connector while being compatible with surface mount assembly processes.

• The terminal is engineered to match the pitch of the connector, with a spacing of 1.25mm between adjacent terminals.

• It is designed for compatibility with surface mount assembly processes, such as reflow soldering, where components are mounted directly onto the surface of the PCB.

• The terminal may feature a specific footprint or land pattern on the PCB to ensure proper alignment and solder joint formation during assembly.

Rated voltage: 50V AC,DC

Working temperature: -25℃~+85℃

Rated current: 1.0A AC,DC

Insulation resistance: 100MΩMin.

Pressure value: 500V AC/minute

Contact resistance: 20MΩMax.